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Semiconductor foundry founded in 1998 by the Malaysian State of Sarawak. 0.18 and 0.25 micron CMOS and mixed signal CMOS IC.

Offers turnkey contract manufacturing, logistics and testing services.

Manufacturer of single crystal oxide wafers for SAW/BAW devices and high bright LED. Also offers contract manufacturing and wafer reclaim service.

Supplying custom coatings and patterned substrates to customers involved with microelectronics with information on coatings, patterning, capabilities, manufacturing and contacts.

Provides high quality thin film coatings, patterned substrates, hybrid and resistor networks.

Silicon epitaxial foundry services to the semiconductor industry. Specializing in thick or multiple epitaxial layers.

An RF IC design service offering solutions for analog RF and mixed-signal projects from draft to production.

Custom thin film deposition and thin film device fabrication.

Custom and standard silicon photodetectors and thick and thin film optoelectronic devices, offering wafer fabrication, bonding and packaging, and testing.

Provides high density interconnect (HDI) substrates and flip chip semiconductor BGA packaging for single or multichip (MCM) modules. Packaging description, technical notes, and company presentations.